IT BUSINESS

EMS

EMS (Electronic Manufacturing Service) refers to a system that specializes in manufacturing and supplying the quantity supplied by Synopex in the electronics field.

By combining the production and supply of precision electronic parts based on Synopex's FPCB, we are focusing on improving the production capacity of precision electronic parts and commercialization for the global market.

Synopex possesses excellent IT technology and know-how, and based on the large-scale production facilities secured in Vietnam, it is possible to respond promptly and stably in related fields such as electronic device manufacturing, and will drive additional corporate growth based on FPCB.

Major Clients

SMT/PBA Line CAPA

C
A
P
A
(month)

SMT - LINE
-F1: Middle and high speed→ 20 Line -F2: High speed→ 8 Line	28-Line
F1: 190 million points, 2nd floor: 230 million points	420 million points

PBA - LINE
F1: 18 LINE 2F: 5 LINE	23Line
F1:25 million units, 2nd floor: 7 million units	3,2 million units

Facility possession status

SMT - LINE
SPI
Middle and High Speed Mounter
High Speed Mounter
Auto Solder Machine
Reflow
AOI
Dual Servo Press
Wave Solder
X-ray

Main process introduction

Import inspection (IQC)

PCB / Component

JIG / Tray etc.

Inspection Standard:
* IPC (International Standard)
* Customer Spec. Compliance
PRINT

Solder Paste Application

Metal Mask Use
* Mask, Squeeze Count Management
* Solder Paste Use Management
SPI

Solder management in print area
* Automatic volume management
* Solder application status management
Mounter

Chip / Deformed material mounting
* LCR Check
* Material mixing management
* Mounting status management
MOI

Parts mounting inspection after mounting
* Verification of mounting status before reflow
* Parts misalignment / Parts dropout management
* Parts mixing and mounting management
Reflow

The process of melting the solder in the form of a paste and combining it with the parts
* N2 concentration management
* Temperature profile management
* Parts joint status management
AOI

Part inspection after reflow
* Verification of mounting status after reflow
* Parts misalignment / Parts dropout management
* Parts mixing and mounting management
X-ray

inspection of area impossible for Visual inspection
* BGA Solder Void Inspection
* Short Inspection at the bottom of parts
Wave Solder

Soldering process of manual parts
* Void / Pin Hole Management
*Wave JIG Management
* Flex and Solder Bar Management
Shipment inspection(OQC)

Final inspection before shipment
* Chip status inspection
* Wave terminal area inspection
* Bare PCB inspection